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CPP EXPO Chicago Re-cap
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CPP EXPO Show News - Tuesday, October 31st
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Sales for future CPP EXPO events began Monday afternoon with exhibitors opting to reserve space in both the 2007 Las Vegas and 2008 Chicago expos. After a busy start to the week, as of Tuesday afternoon over 25% of exhibiting companies have resigned with over half of those re-signed expanding their space for future events. CPP EXPO in 2007 will take place October 15-17 at the Las Vegas Convention Center and will, once again, be partnered and co-located with PACK EXPO and PROCESS EXPO. CPP EXPO’s Educational Program kicked-off today with a CEMA-sponsored breakfast and continued through the afternoon covering topics from safety and web handling to adhesives and sealants in flexible packaging. New products continue to be announced throughout all halls of McCormick – following are a few highlights from the CPP EXPO show floor.
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CI-FLEXO PRESS Highlights Uteco North America’s Offerings at CPP EXPO
Diamond HP 109 press is designed for short runs, increased quality, and reduced waste and set-up times. Heart of the design is the closed and thermo-regulated structure of the CI Printing group and its electric shaft. The main brushless motor is directly flanged to the CI drum axis and the servo drives are directly connected to the plate-sleeve mandrels for best register tolerances. Diamond HP 109 is equipped with two lifting platforms for easy change of sleeves even on the upper decks. Visit www.uteco.com for details; they are located in Booth No. E-9411 at CPP EXPO.
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Remmele Engineering Demonstrates Operator Interface System for May Coating by Remmelle Line at CPP EXPO 2006
Remmele Engineering, an industry leader in both standard and custom web handling and coating equipment, is demonstrating an Operator Interface System for their new May Coating by Remmele line during the upcoming CPP EXPO. Click through for more details.
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